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News - Component TestHigh Speed Probe Card with Data Rates up to 6 Gbps27 March 2018 - aps Solutions GmbH, an authorized distributor of Sedicon Technology from Korea, introduced a new solution for High Frequency Cantilever Probe Cards up to 10 GHz @-3dB or 6 Gbps. High quality Cantilever Probe Cards are offering many advantages for customers. Especially on cost of ownership, robustness, repair ability and delivery time Cantilever Probe Cards are unbeaten. Up to now, the frequency range of High Speed Probing was limited to test frequencies < 1 GHz. Test of 6DOF Gyro Sensors in Singulated Packages22 March 2018 - Multitest launched the next generation of its 6DOF gyro test module for singulated packages, which provides significant production benefits resulting in even lower cost of test, enhanced test accuracy and higher daily output. The new generation 6DOF module has been optimized for operational cost, uptime and stimulus clearness and accuracy. Contactors for Testing Wafer Level Chip Scale Packages08 March 2018 - Multitest introduced the Gemini Kelvin 050 for 0.5mm pitch contacting for packages with continuously shrinking dies, which are needed for smaller, lower current, and faster end-user devices. The Gemini Kelvin contactor is very versatile and can be configured for: single site test, strip test, and multisite WLCSP test. Parametric Test Solution with “TRUE” Per-Pin Architecture01 March 2018 – Keysight Technologies announced the third generation of its P9000 series massively parallel parametric test system. The system accelerates the fast ramp of new technology and reduces the cost-of-test in the development and manufacturing of advanced semiconductor logic and memory ICs. For example, with the new types of device structure and higher performance, the required amount of parametric test data per advanced technology node (less than or equal to 20 nm) is drastically increasing. Stimulus Test Cell for Differential Pressure Sensors22 February 2018 – Advantest launched its HA7300 stimulus test cell, a full capability solution for the testing of differential pressure sensors which are becoming pervasive in modern automobile designs focused on better fuel economy and green technologies. The HA7300 delivers high-speed, highly precise test temperature control with a proprietary technology that utilizes a heat or cold plate to control the temperature of the sensors under test. Automated IC Handler with Thermal Control14 February 2018 - Advantest developed the M4171 handler to meet the mobile electronics market’s needs for cost-efficient thermal control testing of ICs with high power dissipation during device characterization and pre-production bring up. This portable, single-site handler automates device loading and unloading, thermal conditioning and binning in engineering labs, where most testing today involves manual device handling. Final Test of singulated WLCSPs08 February 2018 - Multitest’s new InWaferX final test solution for singulated WLCSPs addresses the increased quality demand for automotive applications as these quality requirements are expanding to cost sensitive, high volume consumer applications. Based on the production proven InCarrier technology, InWaferX ensures highest efficiency and yield for lowest cost of test. More Articles ...
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