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News - Component Test
CAMTEK announces Semiconductor Inspection and Metrology Platform02 April 2014 – Camtek started the customer evaluation of its next generation Semiconductor Inspection and Metrology platform designed for the Advanced Packaging market. The new systems deliver unparalleled 2D and 3D inspection and metrology capabilities for wafers, both before and after testing, along the bumping process or after dicing.
Volume Manufacturing Test Solution for NFC Devices24 March 2014 - LitePoint released its LitePoint IQnfc, the first volume production-optimized test system designed to measure and verify the physical layer performance of Near Field Communication (NFC) enabled devices. Until today, the primary method for production testing of NFC-enabled devices such as smartphones was a “pass/no-pass” approach, often utilizing an off-the-shelf NFC card reader or “passive tag.” This method, however, provides little useful data about system performance, allows marginal or even defective devices to ship to consumers and offers no information about the failure mechanism of devices that do not pass the production test.
Breakdown Testing at up to 10kV20 March 2014 - Keithley Instruments introduced two high voltage power supplies optimized for high voltage device and materials testing and high energy physics and materials science research. The Model 2290-5 5kV Power Supply and Model 2290-10 10kV Power Supply are well suited for high voltage breakdown testing of power semiconductor components. This includes devices made of current- and next-generation wide-bandgap materials like silicon carbide (SiC) and gallium nitride (GaN), designed for use in "green", energy-efficient power generation and transmission systems and hybrid and all-electric vehicles.
Highest Density Power Supply with greater Voltage Range for Semiconductor Test18 March 2014 - Advantest Corporation has extended its V93000 capabilities with the introduction of its new DPS128HV module, a high-density device power supply (DPS) unit designed to handle a wide range of operating voltages for testing devices such as eFlash memory ICs. With the new module, Advantest’s V93000 test platform can be easily scaled from low-channel to high-channel configurations to provide the most economical test solution for each specific device under test.
Advantest Introduces new Test Modules for Next-Generation RF-based ICs12 March 2014 - Advantest Corporation introduced two new test modules for high-speed, cost-efficient testing of radio-frequency (RF) ICs used in cell phones and wireless LAN devices built to meet 802.11ac and LTE-Advanced mobile communication standards. Both the 32-port WLS32-A module and the 16-port WLS16-A module are fully compatible with Advantest’s widely used T2000 platform.
Nordson DAGE opened a new Research and Development Facility10 March 2014 - Nordson DAGE opened its new expanded Research and Development facility in Colchester, Essex, UK. The move to the new location had been planned in line with new R & D programs with subsequent headcount expansion to further drive Nordson DAGE’s Bond Test and X-ray product development programs. The move has doubled the space and added important capability including a new cleanroom facility.
MVTS Technologies acquires Electroglas Wafer Probe Assets from Probe Specialists17 February 2014 – MVTS Technologies has acquired substantially all the assets of Probe Specialists (PSI). Leveraging PSI’s expertise, MVTS will now provide global sales and service for the Electroglas 2001 product line as well as the PSI and Miller Design-created NexGen prober platform. This acquisition furthers MVTS’ investment in the wafer probe market, complementing its current 4090 capabilities. Under the terms of the asset purchase agreement, MVTS has acquired all global inventory and goodwill of PSI, in addition to retaining key directors and employees. More Articles ...
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