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Readers Top 5 News of last 30 days
News - Component TestLTX-Credence announces new Product for Connectivity Device Testing19 December 2012 - LTX-Credence Corporation announced the first product under the Nighthawk brand, NighthawkCT for testing connectivity devices. The NighthawkCT instrument is capable of full quad-site parallel test and up to two NighthawkCT instruments can be configured in a test system allowing for full functional testing of up to eight devices simultaneously. High-Speed Testing of SoCs with Serial, Parallel or Memory Interfaces11 December 2012 - Advantest introduced its new T2000 8-Gbps Digital Module to address the test requirements of system-on-chip (SoC) devices with high-speed serial, parallel and memory interfaces such as PCI-Express and double data rate (DDR) connections. The T2000 8GDM has the versatility to test a wide range of SoC interfaces while operating at data rates up to 8 Gbps. Key capabilities include clock and data recovery (CDR), jitter injection, I/O dead band cancellation and multi-strobe operation. Wafer Inspection Tool for LED and Adjacent Markets10 December 2012 - KLA-Tencor Corporation announced its next-generation light-emitting diode (LED) patterned wafer inspection tool, the ICOS WI-2280. Designed specifically for defect inspection and 2D metrology for LED applications, the ICOS WI-2280 also provides enhanced inspection capabilities and increased flexibility for microelectromechanical systems (MEMS) and semiconductor wafers spanning two inches to eight inches in size. High-Speed Test for CMOS Image Sensing Devices03 December 2012 - Advantest Corporation has introduced the IC industry’s fastest image-capture module to cost-efficiently test the high-frequency, low-power D-PHY and M-PHY interface chips. The new T2000 3Gbps CMOS Image Capture Module operates on Advantest’s T2000 ISS system, an industry-leading test platform for a broad range of system-on-chip (SoC) devices. Wafer MVM-SEM Tool supports Next-Generation Devices26 November 2012 - Advantest has introduced its new Multi-Vision Metrology Scanning Electron Microscope, the Wafer MVM-SEM E3310, which measures fine-pitch patterns on a wide range of wafer types with unparalleled accuracy, utilizing Advantest’s proprietary electron beam scanning technology. Built on advances in the technology used in Advantest’s E3630 MVM-SEM for photomasks, the E3310 achieves superior capabilities for scanning and measurement of wafers for next-generation devices. Mask Defect Review SEM for Next-Generation Photomasks20 November 2012 - Advantest Corporation developed a new mask defect review tool, the Mask DR-SEM E5610, for reviewing and classifying ultra-small defects in photomask blanks. The E5610 inherits the highly stable, fully automatic image capture technology developed by Advantest for its acclaimed multi vision metrology SEM for photomasks, and features a newly developed beam tilt mechanism that enables scanning at oblique angles. Tektronix revolutionizes ASIC Prototyping16 November 2012 - Tektronix introduced version 2.0 of its Certus ASIC prototyping debug solution. A suite of software and RTL-based embedded instruments, Certus 2.0 fundamentally changes the ASIC prototyping flow by enabling full RTL-level visibility and making FPGA internal visibility a feature of the prototyping platform. This simulation-level visibility allows engineers to diagnose multiple defects in a day versus a week or more with existing tools. More Articles ...
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